LONDON (ShareCast) - (Sharecast News) - Chip maker EnSilica said on Monday that it has received a $1.4m purchase order for the next phase of development of a satellite payload application specific integrated circuits, following completion of an initial feasibility study.
EnSilica said the order progressed the programme, orginally referenced in its 3 November announcement, into the next phase of developing a satellite payload ASIC for a global satellite service operator.

The AIM-listed group stated execution of the order will commence in December, with the associated non-recurring engineering revenues to be recognised within the current financial year.

EnSilica added that the order had increased its contractual coverage against its full-year 2026 revenue guidance and that it expects the full satellite payload ASIC programme associated with the order to be worth "several millions of US dollars over FY27 and FY28", should it continue to progress as anticipated.

Chief executive Ian Lankshear said: "We are delighted to have secured this further development order within satellite communications from an existing customer, which marks a significant step towards commitment to a full project. The order reinforces our position as a leading independent supplier of payload communication ASICs, which remain highly complex, requiring advanced digital signal processing and Radio Frequency expertise."







Reporting by Iain Gilbert at Sharecast.com

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