Aim Bulletin

Sondrel achieves tapeout in automotive chip contract

By Josh White

Date: Monday 29 Apr 2024

(Sharecast News) - Chip supplier Sondrel announced the successful completion of a significant milestone in its material turnkey ASIC engagement for a tier-one OEM automotive customer on Monday.
The AIM-traded firm said it had achieved tapeout, marking the culmination of the design phase of an application-specific integrated circuit (ASIC) project.

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